Products Brief: 
       Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
 


Product's Feature:
■Non-contact Measurements. 

■Can be used on all wafer materials including: Silicon，Gallium-Arsenide，Indium Phosphide，  Germanium. 

■Thickness and TTV values are obtained by placing the wafer between non-contact capacitance probes. 

■Thickness and TTV values are indicated on the high resolution LCD display. 

■Provides High Performance at Low Cost. 

■Menu-driven for Fast, Easy Setup. 

■High-resolution LCD Display. 

■RS-232 Output Port to PC. 

■Parallel Port for Printer. 

■Portable and Easy to Set Up 

■provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process. 

■On-board Microprocessor for Accurate, Repeatable Measurements. 

■Teflon Wafer Stage for Easy, Non-abrasive Positioning.


Technique Specification:
■Wafer Sizes: 50mm-300mm. 
■Measurement Range: 1mm standard [1.7 mm Extended]

■Thickness Accuracy: +/-0.25um

■Repeatability: 0.050um
■TTV Accuracy: +/-0.05um

■Repeatability: 0.050um
■Bow Range: +/-500um [+/-850um]

■Accuracy :+/-2.0um

■Repeatability: 0.750um
■Material:Silicon，Gallium-Arsenide，Indium Phosphide，Germanium.
■Surfaces: As-cut, Lapped, Etched, Polished, Patterned. 
■Flat/Notch: All SEMI Standard Flat(s) or Notch. 
■Conductivity: P or N Type. 
■Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape. 
■Continuous and 5-point Measurement.


Application :
■Slicing 
>>Saw set-up 
　　　　>>>Thickness 
　　　　>>>TTV 
>>Degradation monitoring 
>>>Wire guide re-grooving 
>>>Blade replacement 
■Lap/etch and polishing 
>>Process monitoring 
>>Thickness 
>>TTV 
>>Material removal 
>>Bow 
>>Warp 
>>Flatness 
■Backgrind 
>>Removal rate 
■Final Inspection 
>>Lot sampling 
>>Final thickness 
 
Typical Customer: 
American,Europe and Asia and so on.