Design and Mechanical Data
Substrate Material : P-GeBase Material : GaInP/GaAs/GeThickness : 150μm±20μmWelding Method : Weld or SolderAR-coating : TiO x /Al 2 O 3Coverglass : KFG120Coverglass thickness : 120μmCICs Size : 40.1+0.050mm × 80.1+0.050mmCICs thickness : 300±25μmInterconnector thickness : 30μmAverage Weight : ≤115mg/cm 2Bypass Protect : Si DiodeExtra option:1. Different thickness coverglasses can be customized.2. ITO coverglass available.